Key Specs

SpecValueConditionSource
input_current_min15 AminDatasheet
input_current_typ20 ADatasheet
input_current_max25 AmaxDatasheet
voltage_rating_min400 VminDatasheet
voltage_rating_typ1000 VDatasheet
voltage_rating_max1000 VmaxDatasheet
forward_current_rms_min15 AminDatasheet
forward_current_rms_typ20 ADatasheet
forward_current_rms_max25 AmaxDatasheet
average_forward_current_min9.5 AminDatasheet
average_forward_current_typ12.7 ADatasheet
average_forward_current_max15.9 AmaxDatasheet
peak_non_repetitive_surge_current_min225 AminDatasheet
peak_non_repetitive_surge_current_typ300 ADatasheet
peak_non_repetitive_surge_current_max350 AmaxDatasheet
i2t_min210 A2sminDatasheet
i2t_typ374 A2sDatasheet
i2t_max508 A2smaxDatasheet
storage_temperature_min-40 °CminDatasheet
storage_temperature_max150 °CmaxDatasheet
operating_junction_temperature_min-40 °CminDatasheet
operating_junction_temperature_max125 °CmaxDatasheet
reverse_recovery_time_typ4 μsDatasheet
instantaneous_forward_voltage_max1.6 VmaxDatasheet
physical_width_typnot found in textDatasheet
thermal_resistance_max150°C RRaammpp—uuppmaxDatasheet
maximum_allowable_case_temperature_typ217°CDatasheet
peak_temperature_max280°CmaxDatasheet
ramp_up_rate_typ5°C/second max eDatasheet
ramp_up_rate_max5°C/second max emaxDatasheet
ramp_down_rate_typ5°C/second maxDatasheet
ramp_down_rate_max5°C/second maxmaxDatasheet
soldering_temperature_max260°C, 10 seconds °C/secDatasheet
soldering_time_typ20 – 40 secondsDatasheet
surge_current_duration_typ1 10 100 1000Datasheet
switching_frequency_max60Hz sine wavemaxDatasheet
maximum_allowable_case_temperature_min150°C RRaammpp—uuppminDatasheet
maximum_allowable_case_temperature_max280°CmaxDatasheet
peak_temperature_max260+0/-5 °CDatasheet
terminal_finish100% Matte Tin PlatedDatasheet
body_materialMIL-STD-750: Method 1051Datasheet
lead_materialCopper Alloy Biased Temperature & EIA/JEDEC: JESD22-A101Datasheet
solder_heat260°C, 10 seconds °C/secDatasheet
solderability_categoryANSI/J-STD-002, Category 3, Test ADatasheet
load_typeResistive or Inductive Dxx20LDatasheet
conduction_angle180°Datasheet
current_waveformSinusoidalDatasheet
supply_frequency60Hz sine waveDatasheet
average_ramp_up_rate_max5°C/second max eDatasheet
average_ramp_up_rate_minnot found in textDatasheet
solder_heat_max260°C, 10 seconds °C/secDatasheet
solderability_categoryCategory 3test condition stringDatasheet
lead_bend_mil_std_750_method_2036_condition_eCondition Etest condition stringDatasheet
max_continuous_current_percentage_of_rating75%Datasheet
dimension_t_measuring_point_area0.17 IN2 IN^2Datasheet
dimension_t_measuring_point_area_in_millimetersMillimeters mm^2Datasheet
dimension_c_dimension_min0.380 inchesminDatasheet
dimension_c_dimension_typ0.420 inchestypDatasheet
dimension_c_dimension_max0.420 inchesmaxDatasheet
dimension_a_dimension_min13.36 mmminDatasheet
dimension_a_dimension_typ14.99 mmtypDatasheet
dimension_a_dimension_max15.75 mmmaxDatasheet
dimension_b_dimension_min2.67 mmminDatasheet
dimension_b_dimension_typ2.92 mmtypDatasheet
dimension_b_dimension_max2.92 mmmaxDatasheet
dimension_d_dimension_min14.99 mmminDatasheet
dimension_d_dimension_typ15.75 mmtypDatasheet
dimension_e_dimension_min3.61 mmminDatasheet
dimension_f_dimension_min2.79 mmminDatasheet
dimension_g_dimension_min13.72 mmminDatasheet
dimension_h_dimension_min0.64 mmminDatasheet
dimension_j_dimension_min4.95 mmminDatasheet
dimension_k_dimension_min2.41 mmminDatasheet
dimension_l_dimension_min1.52 N-mminDatasheet
mounting_tab_max_torque_to_apply8 in-lbs.Datasheet
mounting_tab_max_torque_in_newton_meters0.904 NmDatasheet
dimension_m_dimension_min2.16 mmminDatasheet
dimension_n_dimension_min0.46 mm^2minDatasheet
dimension_o_dimension_min4.52 mmminDatasheet
dimension_p_dimension_min1.14 mm^2minDatasheet
dimension_r_dimension_min0.97 mm^2minDatasheet

When To Use

  1. 400V DC bus → 200V @ 15A resistive load: The 400V minimum voltage rating ensures safe operation with wide margin on a 400V DC bus, preventing avalanche or breakdown during transient overshoot. Using a device with lower voltage rating here risks catastrophic junction damage from voltage spikes.

  2. Inductive load switching at 20A RMS, 60Hz: The 4 μs reverse recovery time and 15.9A max average forward current rating allow reliable switching with minimal reverse recovery losses and no latch-up under sinusoidal current waveforms. Using a slower diode or one with lower surge current rating could cause excessive thermal stress and shoot-through.

  3. Surge current handling for motor start-up spikes up to 300A: The 300A typical peak non-repetitive surge current rating and 374 A²s I²t rating ensure the device survives typical motor inrush without junction damage. A device with lower surge capability would risk immediate junction overheating and thermal runaway.

When Not To Use

  1. Continuous current above 20A at 60Hz: The maximum continuous forward current maxes at 25A RMS, with recommended operation at 75% of rating for reliability. For higher continuous currents, use a high-current synchronous buck with external FETs to manage both current and efficiency.

  2. Switching frequency above 60Hz sine wave: The max switching frequency rating is 60Hz sine wave, limiting use in high-frequency switching applications. For switching frequencies above 500kHz, use a high-frequency buck controller to avoid excessive switching losses and device failure.

  3. Low-voltage, low-dropout linear regulation (<1V differential): The 1.6V max instantaneous forward voltage drop is excessive for low dropout operation and noise-sensitive analog supplies. Use an LDO regulator for low noise and minimal dropout voltage in these cases.

Application Notes

  • The switching node (SW) should be routed with short, wide copper traces to minimize parasitic inductance and reduce voltage overshoot during commutation.

  • Pins associated with the gate drive and sensing (refer to datasheet pinout, typically pins 3 and 5) are noise-sensitive and should be routed away from high-current switching loops to prevent false triggering or oscillations.

  • Guard rings or ground fills around the diode body are recommended to reduce leakage currents and improve ESD robustness, especially given the 100% matte tin plating which can be prone to whiskers if improperly handled.

  • The 5°C/second max ramp-up and ramp-down rates during soldering must be strictly controlled to prevent internal mechanical stress and bond wire lift-off.

  • The maximum allowable case temperature of 217°C must not be exceeded during operation; ensure thermal interface materials and mounting torque (max 0.904 Nm) are properly applied to maintain junction temperature within limits.

Gotchas

  1. [Mistake]: Exceeding 25A RMS continuous current rating by running at 30A without derating.
    What happens: The junction overheats leading to thermal runaway and permanent device failure due to exceeding maximum operating junction temperature of 125°C.
    Fix: Limit current to 75% of rating (≤ 18.75A continuous) or improve heat sinking to ensure junction temperature remains below 125°C.

  2. [Mistake]: Applying a ramp-up rate faster than 5°C/second during soldering.
    What happens: Causes mechanical stress and microcracks in the die or solder joints, leading to premature open circuits or intermittent failures.
    Fix: Use controlled soldering profiles with ramp rates not exceeding 5°C/second and soldering times limited to 10 seconds at 260°C.

  3. [Mistake]: Using D4015L56 in a high-frequency (>60Hz) PWM switching application.
    What happens: Excessive switching losses and elevated reverse recovery stress cause accelerated junction degradation and eventual catastrophic failure.
    Fix: Restrict switching frequency to ≤ 60Hz sine wave or select a device rated for high-frequency operation.

  4. [Mistake]: Mounting tab torque exceeding 0.904 Nm (8 in-lbs).
    What happens: Excessive mechanical stress fractures the package or damages internal die attach, causing latent or immediate device failure.
    Fix: Use torque-controlled tools and do not exceed specified 0.904 Nm torque during installation.