Key Specs

SpecValueConditionSource
input_voltage_max1300 VmaxDatasheet
input_voltage_repetitive_max1200 VmaxDatasheet
reverse_current_typ10 µAtypDatasheet
forward_voltage_drop_typ_40a1.30 VtypDatasheet
forward_voltage_drop_typ_80a1.59 VtypDatasheet
forward_voltage_drop_typ_40a_125c1.26 VtypDatasheet
forward_voltage_drop_typ_80a_125c1.64 VtypDatasheet
forward_current_max40 AmaxDatasheet
rms_forward_current_typ63 AtypDatasheet
threshold_voltage_max_150c0.85 VmaxDatasheet
slope_resistance_typ9.9 mΩtypDatasheet
thermal_resistance_jc_typ0.4 K/WtypDatasheet
thermal_resistance_ch_typ0.25 K/WtypDatasheet
total_power_dissipation_max_25c310 WmaxDatasheet
forward_surge_current_typ_50hz_10ms520 AtypDatasheet
forward_surge_current_typ_60hz_8ms560 AtypDatasheet
forward_surge_current_typ_50hz_10ms_150c440 AtypDatasheet
forward_surge_current_typ_60hz_8ms_150c475 AtypDatasheet
i2t_fusing_value_typ_50hz_10ms_45c1.35 kA²stypDatasheet
i2t_fusing_value_typ_60hz_8ms_45c1.31 kA²stypDatasheet
i2t_fusing_value_typ_50hz_10ms_150c970 A²stypDatasheet
i2t_fusing_value_typ_60hz_8ms_150c940 A²stypDatasheet
junction_capacitance_typ_25c22 pFtypDatasheet
max_gate_power_dissipation_typ_150c_30us10 WtypDatasheet
max_gate_power_dissipation_typ_150c_300us5 WtypDatasheet
average_gate_power_dissipation_typ0.5 WtypDatasheet
critical_rate_of_rise_current_150c_50hz150 A/µstypDatasheet
critical_rate_of_rise_current_di_dt_200us_0_3a500 A/µstypDatasheet
critical_rate_of_rise_voltage_150c500 V/µstypDatasheet
gate_trigger_voltage_typ1.7 VtypDatasheet
gate_trigger_voltage_min1.9 VminDatasheet
gate_trigger_current_typ30 mAtypDatasheet
gate_trigger_current_min50 mAminDatasheet
gate_non_trigger_voltage_typ⅔ VtypDatasheet
gate_non_trigger_current_min1 mAminDatasheet
latching_current_typ100 mAtypDatasheet
holding_current_typ70 mAtypDatasheet
turn_off_time_typ150 µstypDatasheet
rms_current_min35 AminDatasheet
virtual_junction_temperature_min-40 °CminDatasheet
virtual_junction_temperature_typ150 °CtypDatasheet
operation_temperature_min-40 °CminDatasheet
operation_temperature_typ125 °CtypDatasheet
storage_temperature_min-40 °CminDatasheet
storage_temperature_typ150 °CtypDatasheet
weight_min1.5 gminDatasheet
mounting_force_with_clip_min20 NminDatasheet
dimension_a_min4.06 mmminDatasheet
dimension_a_typ4.83 mmtypDatasheet
dimension_b_min0.51 mmminDatasheet
dimension_b_typ0.99 mmtypDatasheet
dimension_c_min0.40 mmminDatasheet
dimension_c_typ0.74 mmtypDatasheet
input_voltage_min18.3 VminDatasheet
input_voltage_typ80 VtypDatasheet
switching_frequency_max50HzmaxDatasheet
diode_forward_voltage_min1.78 VminDatasheet
diode_forward_voltage_typ3 VtypDatasheet
diode_forward_current_max10AmaxDatasheet
junction_temperature_min-25°CminDatasheet
junction_temperature_typ45°CtypDatasheet
junction_temperature_max150°CmaxDatasheet
thermal_impedance_min0.07K/WminDatasheet
thermal_impedance_typ2.54 K/WtypDatasheet
thermal_impedance_max10.92 K/WmaxDatasheet
gate_voltage_min0VminDatasheet
gate_current_typ10mAtypDatasheet

When To Use

Use this device in high-voltage applications where a low on-resistance is required. The maximum input voltage of 1300 V and repetitive peak input voltage of 1200 V make it suitable for industrial power supplies, motor drives, and renewable energy systems.

The device’s typical forward voltage drop of 1.30 V at 40 A and 1.59 V at 80 A are among the lowest in its class, making it an ideal choice for high-current applications where heat dissipation is a concern.

When Not To Use

  1. >50 Hz switching frequency DC-DC converter: The maximum switching frequency of 50 Hz disqualifies this part for high-frequency converters. Use a high-frequency buck controller instead for switching frequencies above 500 kHz.

  2. Output current >40 A continuous buck regulator: The 40 A maximum forward current limits continuous current capability. For higher current loads, choose a multi-phase buck controller to distribute current across multiple devices.

  3. Battery-powered sensor requiring ultra-low quiescent current: The typical gate and leakage currents exceed 1 mA during standby, draining small batteries. Use a low-IQ PFM buck regulator optimized for μA quiescent currents.

Application Notes

When using this device, it is essential to minimize the loop area for the high-side node (pin 1) to reduce switching losses and EMI. The gate pin (pin 2) is noise-sensitive and should be kept away from high-frequency sources.

A heatsink may be required at a representative operating point of 40 A and 100°C ambient temperature, depending on the application and thermal resistance of the PCB.

Gotchas

Mistake: Not using a suitable gate driver

Failure mode: The device fails to switch on due to insufficient gate drive current or voltage.

Fix/Avoidance: Use a gate driver with a minimum 1.9 V trigger voltage and 50 mA minimum trigger current to ensure reliable switching.

Mistake: Not considering thermal resistance in the PCB design

Failure mode: The device overheats and fails due to excessive junction temperature.

Fix/Avoidance: Use thermal simulation tools to ensure that the device’s maximum allowed junction temperature of 150°C is not exceeded. A heatsink may be necessary depending on the operating conditions.