Key Specs

SpecValueConditionSource
input_voltage_non_repetitive_reverse_forward_blocking_max1300 VmaxDatasheet
input_voltage_repetitive_reverse_forward_blocking_max1200 VmaxDatasheet
input_current_typ10 µAtypDatasheet
input_current_max_at_25_celsius2 mAmaxDatasheet
input_current_typ_at_25_celsius10 µAtypDatasheet
input_current_max_at_125_celsius2 mAmaxDatasheet
input_voltage_drop_typ_at_30_ampere1.28 VtypDatasheet
input_voltage_drop_typ_at_60_ampere1.56 VtypDatasheet
input_voltage_drop_typ_at_30_ampere_and_125_celsius1.25 VtypDatasheet
input_voltage_drop_typ_at_60_ampere_and_125_celsius1.61 VtypDatasheet
average_forward_current_max_at_120_celsius_and_150_celsius30 AmaxDatasheet
rms_forward_current_typ47 AtypDatasheet
threshold_voltage_typ_at_150_celsius0.86 VtypDatasheet
slope_resistance_typ12.5 mΩtypDatasheet
thermal_resistance_junction_to_case_typ0.5 K/WtypDatasheet
thermal_resistance_case_to_heatsink_typ0.3 K/WtypDatasheet
total_power_dissipation_typ_at_25_celsius250 WtypDatasheet
max_forward_surge_current_typ_at_45_celsius300 AtypDatasheet
max_forward_surge_current_typ_at_150_celsius255 AtypDatasheet
i2t_value_for_fusing_typ_at_45_celsius450 A²stypDatasheet
i2t_value_for_fusing_typ_at_150_celsius325 A²stypDatasheet
junction_capacitance_typ_at_25_celsius_and_400_volt13 pFtypDatasheet
max_gate_power_dissipation_typ_at_150_celsius10 WtypDatasheet
max_gate_power_dissipation_typ_at_300_microsecond5 WtypDatasheet
average_gate_power_dissipation_typ0.5 WtypDatasheet
critical_rate_of_rise_of_current_typ_at_150_celsius_and_50_hz150 A/µstypDatasheet
critical_rate_of_rise_of_current_typ_at_200_microsecond_and_300_a500 A/µstypDatasheet
critical_rate_of_rise_of_voltage_typ_at_150_celsius500 V/µstypDatasheet
gate_trigger_voltage_typ_at_25_celsius1.3 VtypDatasheet
gate_trigger_voltage_typ_at_minus_40_celsius1.6 VtypDatasheet
gate_trigger_current_typ_at_25_celsius28 mAtypDatasheet
gate_trigger_current_typ_at_minus_40_celsius50 mAtypDatasheet
input_voltage_min50HzminDatasheet
input_voltage_typ50Hz,80%typDatasheet
input_voltage_max50HzmaxDatasheet
switching_frequency_min60 HzminDatasheet
switching_frequency_typ280 HztypDatasheet
switching_frequency_max1000 HzmaxDatasheet
junction_temperature_min40°CminDatasheet
junction_temperature_typ45°CtypDatasheet
junction_temperature_max125°CmaxDatasheet
forward_current_min100[A]minDatasheet
forward_current_typ[160][A] 20typDatasheet
forward_current_max[100[A]]maxDatasheet
gate_voltage_min0VminDatasheet
gate_voltage_typ[160][A] 20typDatasheet
gate_voltage_max[100[A]]maxDatasheet
surge_current_min4 AminDatasheet
surge_current_typ[102][A] 80typDatasheet
surge_current_max4 AmaxDatasheet
power_dissipation_min[60] [W]minDatasheet
power_dissipation_typ[30][I] [T] [A] 80 [A]typDatasheet
power_dissipation_max[10][I] [T] [A]maxDatasheet
thermal_impedance_min[10][I] [T] [A] [s]minDatasheet
thermal_impedance_typ[20][I] [T] [A] 75[A] [s]typDatasheet
thermal_impedance_max[20][I] [T] [A] [s]maxDatasheet

When To Use

This device is ideal for high-power applications requiring a fast switching frequency and low on-state resistance. Consider using the CLB30I1200HB in:

  • High-efficiency DC-DC converters operating at 280 Hz
  • Industrial motor drives where a high current capability and low thermal resistance are essential
  • Renewable energy systems, such as solar inverters, that require a reliable and efficient power switching solution

When Not To Use

Avoid using the CLB30I1200HB in applications with very low voltage requirements or those sensitive to gate trigger voltages. Consider alternative solutions for:

  • Low-voltage DC-DC converters (e.g., lower than 400 V)
  • Applications where a precise control over gate trigger voltages is necessary
  • Systems requiring a high surge current capability at low temperatures

Application Notes

  • Node Switching: The CLB30I1200HB is designed for high-power applications. To minimize switching losses, ensure that the node with the smallest loop area switches first.
  • Noise-Sensitive Pins: Be cautious when handling the device, as pin 1 (gate) and pin 2 (source) are sensitive to noise and electrostatic discharge (ESD).
  • Heatsink Requirements: For representative operating points, a heatsink may be necessary to maintain the device’s junction temperature within specifications. Consult the datasheet for thermal resistance values and heat sink selection guidance.

Gotchas

Failure Mode 1: Insufficient Gate Trigger Voltage

  • Engineer mistake: Using a gate trigger voltage below the minimum recommended value.
  • Actual failure mode: Device fails to turn on, causing a short circuit and potentially leading to thermal runaway.
  • Fix: Ensure the gate trigger voltage is above the minimum recommended value (typically 1.3 V at 25°C).

Failure Mode 2: Overheating

  • Engineer mistake: Not providing adequate heat sinking or not considering the device’s maximum power dissipation rating.
  • Actual failure mode: Device overheats, causing a reduction in lifespan and potentially leading to catastrophic failures.
  • Fix: Ensure proper heat sinking and maintain the device’s junction temperature within specifications (typically below 125°C).